Figure (1) shows how the BGA die/chip is mounted on the substrate and connected to the substrate by wire bonding technology. Figure 1: Die connected to BGA with wire bond technology Figure 2: Die connected to the BGA using Flip-chip technologyįigure (1) and Figure (2) display two examples of how BGA devices are constructed. These solder balls are affixed to a laminated substrate at the bottom of the package. This SMD package employs an array of metal spheres that are made of solder called the solder balls for connections to the PCB (Printed Circuit Board). In this article, we discuss the following,Ī Ball Grid Array Integrated Circuit is a surface mount device (SMD) component that possesses no leads. This enables the design and manufacture of compact products.īGA devices are used extensively in modern products such as mobiles, PCs, and various communication devices. Such BGA ICs have a smaller form factor and help decrease the size of circuits. BGA ICs having 4 pins to more than 500 IO’s are commonly available. The need for more interfacing input/output (I/O) leads and smaller device sizes have increased and this need can be met with the BGA (Ball Grid Array) package. RLC Resonant Frequency and Impedance CalculatorĮlectronic devices are shrinking in size and increasing in complexity due to improvements in VLSI technology.
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